SK hynix and TSMC Partner to Develop Next-Generation HBM4 Memory Chips

SK hynix, a leading South Korean memory chipmaker, has announced a strategic collaboration with Taiwan Semiconductor Manufacturing Company (TSMC) to jointly develop the next-generation High Bandwidth Memory (HBM4) chips. The partnership aims to enhance the performance and integration of HBM technology through advanced packaging techniques, with mass production of HBM4 expected to begin in 2026.

The collaboration will focus on improving the performance of the base die, a critical component in the HBM package, by leveraging TSMC's advanced logic process. SK hynix plans to adopt TSMC's cutting-edge technology for the HBM4's base die, enabling additional functionality to be packed into limited space and allowing SK hynix to produce customized HBM solutions that meet a wide range of customer demands.

In addition to base die optimization, SK hynix and TSMC will work together to optimize the integration of SK hynix's HBM and TSMC's CoWoS (Chip on Wafer on Substrate) packaging technology. This collaboration is expected to lead to more innovations in HBM technology and enable breakthroughs in memory performance through the combined expertise of product design, foundry, and memory provider.

Why this matters: The partnership between SK hynix and TSMC is a significant development in the AI and high-performance computing industries, as HBM technology plays a crucial role in enabling faster data processing and improved power efficiency. The collaboration is expected to accelerate the development of advanced AI memory solutions and strengthen SK hynix's market leadership in the growing AI chip market.

SK hynix is a top supplier of HBM chips to US-based chip titan Nvidia, which heavily relies on high-bandwidth memory for its AI processors. The collaboration with TSMC, who also supplies Nvidia, aims to meet the increasing demand for high-performance AI-powered chips and deliver the best-integrated solutions to unlock new AI innovations for their common customers.

The memorandum of understanding signed between SK hynix and TSMC marks a significant step forward in the development of next-generation HBM technology. By combining SK hynix's expertise in memory chip design and TSMC's advanced foundry capabilities, the partnership is poised to drive innovation and shape the future of memory technology, particularly in the growing AI, 5G, and IoT markets.

Key Takeaways

• SK hynix and TSMC to jointly develop next-gen HBM4 chips, mass production by 2026.
• Collaboration to enhance HBM performance and integration through advanced packaging techniques.
• SK hynix to adopt TSMC's advanced logic process for HBM4 base die, enabling customized solutions.
• Partnership aims to accelerate AI memory solutions and strengthen SK hynix's AI chip market leadership.
• Collaboration combines SK hynix's memory expertise and TSMC's foundry capabilities to drive innovation.