LPKF's LIDE Technology Drives Shift to Glass Packaging for Advanced Semiconductor Chips

LPKF Laser & Electronics SE announces its LIDE technology is enabling the semiconductor industry's transition to glass packaging for advanced chips. The company has increased production capacities to meet growing demand from data center and automotive markets.

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Bijay Laxmi
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LPKF's LIDE Technology Drives Shift to Glass Packaging for Advanced Semiconductor Chips

LPKF's LIDE Technology Drives Shift to Glass Packaging for Advanced Semiconductor Chips

LPKF Laser & Electronics SE announced on May 13, 2024 that its LIDE (Laser-Induced Deep Etching) technology is enabling the semiconductor industry's transition to glass packaging for advanced chips. This shift is being driven by growing demand from the data center and automotive markets, where major global players are adopting glass substrates as the new standard.

The semiconductor industry faces challenges including competitive pricing, supply chain differentiation, and evolving requirements due to changing markets. To address the slowdown of Moore's law, chipmakers are moving towards advanced packaging and heterogeneous integration using chips manufactured with various cutting-edge processes.

Why this matters: The adoption of glass packaging for advanced semiconductor chips has significant implications for the future of technology, as it enables faster and more efficient data processing. This shift could lead to breakthroughs in fields such as artificial intelligence, 5G networks, and autonomous vehicles.

LPKF's LIDE technology has reached a high level of maturity, enabling high-volume production of glass substrates for advanced packaging. "Our technology reached an outstanding level of maturity to meet the semiconductor industry's needs. For that reason, we increased our production capacities in 2024 to satisfy the increasing customer demand," stated Klaus Fiedler, CEO of LPKF.

The LIDE process can quickly and precisely handle glass substrates from 100μm up to 1.1mm thick without causing microcracks or other damage. The technology's high process maturity and proven performance have convinced global players to partner with LPKF. The company supports customers in adopting glass core for advanced packaging, either by integrating LIDE into their manufacturing processes or providing manufacturing services through its Vitrion division.

With dozens of LIDE tools installed worldwide and thousands of glass substrates manufactured in its own facility, LPKF has demonstrated the technology's maturity. "Global players value the high precision, flexibility, and design freedom of LIDE technology," emphasized Dr. Roman Ostholt, Managing Director Electronics at LPKF. The company's long-standing market presence and experience make it a trusted partner, fueling rising demand for its solutions from semiconductor manufacturers.

LPKF Laser & Electronics SE, founded in 1976 and based in Garbsen, Germany, is a leading provider of laser-based solutions for the technology industry. The company has a global presence through subsidiaries and representative offices, and its shares are traded in the Prime Standard segment of Deutsche Börse.

As the semiconductor industry grapples with the challenges of advancing chip performance, LPKF's LIDE technology is emerging as a key enabler for the transition to glass packaging. With major players in data center and automotive markets driving adoption, glass substrates are poised to become the new standard for advanced semiconductor packaging.

Key Takeaways

  • LPKF's LIDE tech enables glass packaging for advanced semiconductor chips.
  • Glass packaging boosts data processing speed and efficiency.
  • LPKF's LIDE tech reaches high maturity, meeting industry demands.
  • Global players adopt glass substrates for advanced packaging.
  • LPKF supports customers with LIDE integration and manufacturing services.